The device referred to when an IC has two rows of parallel connecting pins is a **DIP**, which stands for Dual In-line Package. A DIP typically has pins arranged in two parallel rows and is commonly used for integrated circuits.

Here’s a brief explanation of the other options for clarity:

1. **CMOS**: Complementary Metal-Oxide-Semiconductor, a technology for constructing integrated circuits, but not a package type.
2. **QFP**: Quad Flat Package, which has pins on all four sides; it is different from the DIP.
3. **Phase Splitter**: A circuit configuration often used in amplifiers, unrelated to the packaging of ICs.

In summary, the correct answer is **DIP**, as it specifically describes the layout of having two rows of pins.

Question

The device referred to when an IC has two rows of parallel connecting pins is a **DIP**, which stands for Dual In-line Package. A DIP typically has pins arranged in two parallel rows and is commonly used for integrated circuits.

Here’s a brief explanation of the other options for clarity:

1. **CMOS**: Complementary Metal-Oxide-Semiconductor, a technology for constructing integrated circuits, but not a package type.
2. **QFP**: Quad Flat Package, which has pins on all four sides; it is different from the DIP.
3. **Phase Splitter**: A circuit configuration often used in amplifiers, unrelated to the packaging of ICs.

In summary, the correct answer is **DIP**, as it specifically describes the layout of having two rows of pins.

Knowee AI · Accepted Answer

The device referred to when an IC has two rows of parallel connecting pins is a **DIP**, which stands for Dual In-line Package. A DIP typically has pins arranged in two parallel rows and is commonly used for integrated circuits.

Here’s a brief explanation of the other options for clarity:

1. **CMOS**: Complementary Metal-Oxide-Semiconductor, a technology for constructing integrated circuits, but not a package type.
2. **QFP**: Quad Flat Package, which has pins on all four sides; it is different from the DIP.
3. **Phase Splitter**: A circuit configuration often used in amplifiers, unrelated to the packaging of ICs.

In summary, the correct answer is **DIP**, as it specifically describes the layout of having two rows of pins.

When an IC has two rows of parallel connecting pins, the device referred to as: CMOS a QFP a phase splitter a DIP

Question

When an IC has two rows of parallel connecting pins, the device referred to as:

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