When an IC has two rows of parallel connecting pins, the device referred to as: CMOS a QFP a phase splitter a DIP
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Solution 1
The device is referred to as a DIP (Dual In-line Package). This is a type of integrated circuit packaging. A DIP is characterized by two parallel rows of pins extending perpendicularly from a rectangular package. This is a common type of package for microprocessors and memory ICs. Knowee AI is a powerful AI-powered study tool designed to help you to solve study problem. Knowee AI is a po
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